描述
無描述配置
Chemical & Mechanical PolishingOEM 代工型號說明
The Applied Reflexion GT platform, the industry's only available 300mm dual-wafer CMP product delivers the highest throughput density at the lowest cost per wafer. Serving copper and tungsten applications, the platform is extendible to other applications and future technology nodes. Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system's advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. This is akin to having a mower that can cut every blade of grass on an American football field to the same length within the width of a human hair. For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied Materials' production-proven Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying.文檔
無文檔
APPLIED MATERIALS (AMAT)
REFLEXION GT
已驗證
類別
CMP
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
100904
晶圓尺寸:
未知
年份:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
REFLEXION GT
類別
CMP
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
100904
晶圓尺寸:
未知
年份:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Chemical & Mechanical PolishingOEM 代工型號說明
The Applied Reflexion GT platform, the industry's only available 300mm dual-wafer CMP product delivers the highest throughput density at the lowest cost per wafer. Serving copper and tungsten applications, the platform is extendible to other applications and future technology nodes. Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system's advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. This is akin to having a mower that can cut every blade of grass on an American football field to the same length within the width of a human hair. For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied Materials' production-proven Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying.文檔
無文檔
類似上架商品
查看全部無類似上架商品