描述
Applied Materials MIRRA-3400 Wafer Grinding, Lapping & Polishing, W-CMP配置
4 Titian 1 heads, 2 plantensOEM 代工型號說明
The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.文檔
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APPLIED MATERIALS (AMAT)
MIRRA
已驗證
類別
CMP
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
105379
晶圓尺寸:
未知
年份:
1998
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
MIRRA
類別
CMP
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
105379
晶圓尺寸:
未知
年份:
1998
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Applied Materials MIRRA-3400 Wafer Grinding, Lapping & Polishing, W-CMP配置
4 Titian 1 heads, 2 plantensOEM 代工型號說明
The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.文檔
無文檔