描述
無描述配置
<span style="font-family: calibri,sans-serif;">• Wafer Size (inches) : 8 • Install Type : Through-the-wall • Year of Manufacture: 1999 • Software Version : MB59c3 • CPU Board Type : Pentium 3 400MHz or Higher : Yes • Electrical Requirements : 200/208VAC • Process Type: Polysilicon • Mainframe: Mirra Track o Dry In/Dry Out o Signal Lamp Tower o Integrated SMIF (qty 3 loaders) o Cassette Tank : Standard o Robot Type : 112” o Cleaner Type : Ontrak o Cleaner Chemicals Used : CP72 o E-Chain Lifetime : Since installation o Cleaning Package : No o Spray Gun : Single o In-Situ Removal Rate Monitor : Motor Torque o Metrology Option : None o IPM : No <b>• Mirra Polish Heads</b> o Titan 1 Polish Heads o PPS Retaining Rings o Standard Wafer Loss Sensor <b>• Mirra Platens</b> o Teflon Coated Platens : No o Pad Type : IC 1000 o Pad Conditioner Head : P4 Intel o Pad Conditioner Disc : EWHA o Universal Disk Holder : No o Temperature Control : None <b>• Slurries</b> o Slurries/Platen Used : 1 o Chemicals Used : Oxide Slurry o Flow Rate : Standard o Dispense Arm : Standard o Slurry Flow Monitors : Yes </span>OEM 代工型號說明
The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.文檔
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APPLIED MATERIALS (AMAT)
MIRRA
已驗證
類別
CMP
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
18233
晶圓尺寸:
8"/200mm
年份:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
MIRRA
已驗證
類別
CMP
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
18233
晶圓尺寸:
8"/200mm
年份:
1999
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
<span style="font-family: calibri,sans-serif;">• Wafer Size (inches) : 8 • Install Type : Through-the-wall • Year of Manufacture: 1999 • Software Version : MB59c3 • CPU Board Type : Pentium 3 400MHz or Higher : Yes • Electrical Requirements : 200/208VAC • Process Type: Polysilicon • Mainframe: Mirra Track o Dry In/Dry Out o Signal Lamp Tower o Integrated SMIF (qty 3 loaders) o Cassette Tank : Standard o Robot Type : 112” o Cleaner Type : Ontrak o Cleaner Chemicals Used : CP72 o E-Chain Lifetime : Since installation o Cleaning Package : No o Spray Gun : Single o In-Situ Removal Rate Monitor : Motor Torque o Metrology Option : None o IPM : No <b>• Mirra Polish Heads</b> o Titan 1 Polish Heads o PPS Retaining Rings o Standard Wafer Loss Sensor <b>• Mirra Platens</b> o Teflon Coated Platens : No o Pad Type : IC 1000 o Pad Conditioner Head : P4 Intel o Pad Conditioner Disc : EWHA o Universal Disk Holder : No o Temperature Control : None <b>• Slurries</b> o Slurries/Platen Used : 1 o Chemicals Used : Oxide Slurry o Flow Rate : Standard o Dispense Arm : Standard o Slurry Flow Monitors : Yes </span>OEM 代工型號說明
The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.文檔
無文檔