描述
無描述配置
22VOEM 代工型號說明
Flip Chip Bonder文檔
無文檔
SHINKAWA
COF 300
已驗證
類別
Flip Chip Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
80507
晶圓尺寸:
8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部SHINKAWA
COF 300
類別
Flip Chip Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
80507
晶圓尺寸:
8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
22VOEM 代工型號說明
Flip Chip Bonder文檔
無文檔