描述
無描述配置
Newport 6000/6560A Laser Diode Controller. Comprehensive laser diode protection features. Advanced 16-bit control technology. Complete laser diode characterization (L,V, I). Intuitive front panel controls. Standard GPIB/IEEE-488.2 and RS-232 interfaces. Integrated 32 W temperature controller. 6560A Laser Diode Driver Module: Output Current Range (mA): 0-6000. Output Current Resolution: 0.0916. Output Current Accuracy: +/-(0.03 percent + 180 µA). Compliance Voltage (V): 5. Temperature Coefficient (ppm FS/ deg C): Less than 50. Short-Term Stability (1 h) (ppm FS): Less than 10. Long-Term Stability (24 h) (ppm FS): Less than 50. Noise/Ripple (rms) (µA). 100-240V, 50/60 Hz, CE.OEM 代工型號說明
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.文檔
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NEWPORT
MRSI 605
已驗證
類別
Bonders
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
23191
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NEWPORT
MRSI 605
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
23191
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Newport 6000/6560A Laser Diode Controller. Comprehensive laser diode protection features. Advanced 16-bit control technology. Complete laser diode characterization (L,V, I). Intuitive front panel controls. Standard GPIB/IEEE-488.2 and RS-232 interfaces. Integrated 32 W temperature controller. 6560A Laser Diode Driver Module: Output Current Range (mA): 0-6000. Output Current Resolution: 0.0916. Output Current Accuracy: +/-(0.03 percent + 180 µA). Compliance Voltage (V): 5. Temperature Coefficient (ppm FS/ deg C): Less than 50. Short-Term Stability (1 h) (ppm FS): Less than 10. Long-Term Stability (24 h) (ppm FS): Less than 50. Noise/Ripple (rms) (µA). 100-240V, 50/60 Hz, CE.OEM 代工型號說明
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.文檔
無文檔