CBC200
類別
Bonders概述
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
活躍中的上架商品
5
服務
檢驗、保險、評估、物流
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
5
檢驗、保險、評估、物流