The EVG610 bond alignment system is designed for wafer-to-wafer alignment up to 200 mm wafer sizes. EV Group's bond alignment systems offer a manual high-precision alignment stage with bottom-side microscope. The precision of EVG's bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVG610 BA

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