描述
FE配置
無配置OEM 代工型號說明
The ESEC Die Bonder 2008hSplus is the successful combination of the speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008xP platform. The ultra fast vision system together with the enhanced Pick & Place enable production runs of 13,000 units per hour. The 2008hSplus is the ultimate epoxy die bonder with regards to handling metal lead frames, substrates, thin die, stacked die and wafer back side lamination. Of course this bonder family handle文檔
無文檔
BESI / ESEC
2008 HS PLUS
已驗證
類別
Bonders
上次驗證: 4 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
100237
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
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BESI / ESEC
2008 HS PLUS
類別
Bonders
上次驗證: 4 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
100237
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
FE配置
無配置OEM 代工型號說明
The ESEC Die Bonder 2008hSplus is the successful combination of the speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008xP platform. The ultra fast vision system together with the enhanced Pick & Place enable production runs of 13,000 units per hour. The 2008hSplus is the ultimate epoxy die bonder with regards to handling metal lead frames, substrates, thin die, stacked die and wafer back side lamination. Of course this bonder family handle文檔
無文檔
類似上架商品
查看全部無類似上架商品