The Alphasem Easyline 8033 clip-attach system is the answer for high-speed clip-attach applications for power devices such as SOD, SMA, DPAK, TO 220, etc. The clip-attach process replaces the wire connection between die and the leads with a solid copper bridge where no wire bonder is longer needed.

K&S acquired Alphasem. Alphasem is a leading supplier of die bonder equipment and MEMS packaging equipment. 


KULICKE & SOFFA (K&S) / ALPHASEM

EASYLINE 8033

Inline die and copper clip attach with reflow oven curing – 3 complete lines.
The entire line consist Die attach D1, Die attach D2, IMBR (copper clip attach) and reflow oven.
All the D1, D2 and IMBR machine has fully refurbished. The oven and filter is brand new machine.
 

EASYLINE 8033

類別

概述

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