TWS-DC3111
概述
Specialized semiconductor manufacturing tool used as a wafer demounter (or debonder) for ultra-thin wafers in advanced 2.5/3D packaging
活躍中的上架商品
1
服務
檢驗、保險、評估、物流
Specialized semiconductor manufacturing tool used as a wafer demounter (or debonder) for ultra-thin wafers in advanced 2.5/3D packaging
1
檢驗、保險、評估、物流
