The Ultra Dimension LV is an innovative solution combining Automated Optical Inspection, 2D Laser Via measurement and next generation Remote Multi-Image Verification (RMIV Pro) solution for laser vias. Powered by Orbotech’s Triple Vision Technology™, the Ultra Dimension LV is designed to meet the market’s constantly evolving requirements for quality and reliability in advanced PCB production, including SLP/ mSAP, advanced HDI, advanced flex and IC substrates.

KLA-Tencor Corporation announced the completion of the acquisition of Orbotech Ltd.

Orbotech is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes.

ULTRA DIMENSION LV

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