Automated inspection for microelectronics inspects bond wires, die placement, SMT components and substrates, all within a footprint less than 1 sq. meter.

Nordson / Yestech ; Automated Optical Inspection Systems (AOI). Printed circuit board assembly & packaging. 
https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/profile/history

Nordson / MatriX ; Automated Optical Inspection Systems (AOI). Automated X-Ray Inspection (AXI) & Manual X-ray Inspection (MXI). Bonder Testing. 

http://www.m-xt.com/products/in-line-inspection-for-electronics/

M1m

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