Trion Technology, Inc. manufacturers a wide variety of Plasma Etch and Deposition Systems for the Failure Analysis, Compound Semiconductor, MEMS, Opto-Electronic, Photovoltaic, and Research markets.

TRION	

TITAN

SIRUS T2

The Minilock system incorporates a vacuum load-lock in a compact table top console. The system has been designed to meet all the safety and equipment needs for the more challenging processes in the laboratory environment. Its modular design and optional gas cabinet provide the user with a turnkey system that meets your safety, facility and processing needs. The Minilock is suitable for anisotropic etching of aluminum, silicides, gallium arsenide and other materials requiring chlorinated chemistries. It is also suitable for anisotropic etching of silicon dioxide, silicon nitride and other materials requiring high selectivity and a controlled anisotropic etch. The system specifications are 35"Wx26"Dx48"H with RF Power of 600 watt, 13.56 MHz and up to 6 Mass Flow Controllers. The maximum wafer size is up to 8".

MINILOCK

MINILOCK PHANTOM II

Reactive Ion Etch System with a Vacuum Load-Lock

MINILOCK II

PHANTOM II

The Phantom III is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries. The system has a compact, modular design built on a space-saving platform.

PHANTOM III

TRION PHANTOM III RIE is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries. The system has a compact, modular design built on a space-saving platform.

The PHANTOM III can produce wafer size of 8”. It comes with a vacuum load-lock that allows for isolation of the reaction chamber from atmosphere to reduce the impact of exposure to atmosphere between runs.

PHANTOM III RIE

ORION III

This Reactive Ion Etch (RIE) system etches materials such as silicon nitride, silicon oxide, GaN, and chromium, along with photoresist and various organic materials. The TRION Minilock Phantom contains Inductively Coupled Plasma (ICP) to maximize etch speed and its vacuum lockload allows the main chamber to remain pumping while loading or unloading sample for efficiency. Configuration includes 4 gas channels, 4 tylan mass flow controllers, advanced energy RFX-600 RF generator, corrosion resistant turbomolecular pump with controller, dry pump, and vacuum gauge.

The Minilock-Phantom RIE ICP is an advanced high density etching system with a vacuum loadlock and an Inductively Coupled Plasma source. It has been designed to provide innovative, leading edge processes. The small footprint and robust design make it ideal for both research and production environments.

TRION

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