Kulicke & Soffa Closes Acquisition Of Orthodyne Electronics. Orthodyne Electronics Corporation, a supplier of wedge bonders and wedges for the power management and hybrid module markets.

"Introducing the Model 360 large wire bonder, a cutting-edge system designed to enhance your productivity. With an impressive bonding rate of 70 bonds per minute, it outperforms previous systems by increasing throughput by 25%. Despite its powerful capabilities, this wire bonder boasts compact dimensions, measuring only 60cm (W) x 105cm (D) x 182cm (H).

Equipped with a deep access bond head and an exclusive pattern recognition system, the Model 360C system automates the bonding process for a wide range of electronic packages. Whether you require aluminum or copper wire measuring 125 to 650 um, this system has you covered. Thanks to its computer-controlled four-axis bond head, you can easily bond various types of modules, lead frames, and hybrid substrates. The travel lengths are 6 inches (x direction), 10 inches (Y direction), and 2 inches (Z direction), ensuring flexibility in your bonding operations.

Furthermore, the Model 360 large wire bonder ensures exceptional precision, with bond head positioning accuracy within 1um. Trust in this advanced system to optimize your productivity and streamline your electronic bonding tasks."

KULICKE & SOFFA / ORTHODYNE

M360C

7200

M360 CHD 

20B	

3600Plus Large Wire Wedge Bonder
deal for power hybrids, automotive modules, and solar applications.
Orthodyne added the latest in motion control technology and advanced software to the proven 3600 bonder to produce the fastest, most productive, large wire and ribbon bonder on the market - the 3600Plus.
The 3600Plus meets the most challenging advanced packaging requirements with technology that delivers high productivity, process stabiliy, low cost of ownership (COO) and the flexibility to grow with market demands.

3600plus

M360

The 3600plus and 7200plus wedge bonders are currently the leading choices for power interconnects in both the power hybrid and semiconductor markets.

7200plus

360B

M 360A

The 3700Plus is a high-accuracy, high-speed, small wire-bonder designed for COB, Hybrid and MCM type applications. 

3700PLUS

Automatic Dual Head Wire Bonder. Bonds to almost any electronic package requiring 100-500 micron (4-20 mil) wire.
Four-axis head allows bonding in any direction, to any type of module, leadframe or hybrid substrate.
Programmable bonding parameters for each bond produce better bond quality and reliability.
Programmable indexing and simplified tooling for fast, simple and repeatable production changeovers.
Enhanced process control features can be individually modified for each bond.
Orthodyne proprietary gray-scale pattern recognition system gives higher yield and throughput rates.
Low maintenance bond head with no pivot bearing or solenoids to bind or wear.
Enhanced diagnostics, statistics and wire handling features for better process control.
Sophisticated, menu driven software is easy to program and modify.
Options include non-destructive pull testing with exclusive built-in loop height detector, and destructive pull test mode.

360 C-HD

360 CHD

M20B

he 3600 is a high-speed, high-accuracy wire bonder designed for power modules, automotive packages and other large wire MCM applications.

3600

M3600

360C

Wedge bonder, smaller power packages using either aluminum wire or ribbon.

7200HD

Small Wire Bonder/Small Wire Conversion kit.
Bonds to almost any electronic package requiring 38-75 micron (1.5-3 mil) wire.
Four-axis head allows bonding in any direction, to any type of module, leadframe or hybrid substrate.
Programmable bonding parameters for each bond produce better bond quality and reliability.
Available as a stand-alone machine, as part of a large and small dual head bonder, or as a retrofit to an existing 360C large wire bonder.
Unique low maintenance bond head provides soft touchdown combined with high resolution LVDT for controlled bond placement.
Motorized dereeler assembly and jewel bearing wire feed mean better looping control, low maintenance, and high uptime.
Programmable lift-off angle and wire feed minimize heel cracks.
Modular and flexible design makes for easy integration into automated lines and easy changeover between small and large wire.

360S

Wedge bonder, power semiconductors including smaller power packages using either aluminum wire or ribbon.

KULICKE & SOFFA / ORTHODYNE

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