Fully automatic wafer breaking system - Wafer singulation & dicing 

OPTO SYSTEM

WBF6000

OBM-90TP

WMSS2000

WDS2200	

WPS3100

WBS-4000 

This system is a device that converts scribed wafers into chips with break blades. Alignment is performed automatically by image processing. In addition, it is a fully automatic specification that automatically feeds wafers from a cassette containing rings.

1) General-purpose material wafer
2) Wafer size 8 inches or less　
3) Chip size 200 μm square or more Aspect ratio 1.5 or more
4) Workpiece mounting accuracy ±3 mm or less

WBF8000

WBS6000

LDH-30TS

SGM-6301

LDH-50TS 

The Fully Automatic Bar stacker VJSB3000 is designed to stack laser diode bars separated by spaces in a jig .The machine automatically picks up the laser diode bars and spacers from the tape and sets them alternately in a customized holding jig in preparation for the coating process. The stacked jig is then removed and used to facilitate plasma coating of the bars on both facets The machine incorporated a number of designed features to facilitate efficient high-volume stacking of LD bars including an optimized Jig station, easy Jig closing and handling, high placement accuracy and repeatability utilizing three axis placement robot arms.

VJSB3000

VMFA1004

KBM-110

OSM-90TS

OPTO SYSTEM

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WBF6000

OBM-90TP

WMSS2000

WDS2200

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