Nordson MARCH was formed through the merging of March Instruments of Concord, California, USA and Advanced Plasma Systems (APS) of St. Petersburg, Florida, USA. The company was acquired in 1999 by Nordson Corporation and referred to as March Plasma Systems until renamed Nordson MARCH in 2009.

https://www.nordson.com/en/divisions/march

NORDSON / MARCH

StratoSPHERE

Plasma Treatment System
The XTRAK provides maximum performance and flexibility for surface treatment of electronic devices. With its innovative handling system, the XTRAK is ideal for applications such as adhesion promotion and contamination removal in a highly automated, in-line manufacturing operation or island configuration.

XTRAK

Plasma Cleaner

Plasma System

•Uniform PCB treatment for desmear, landing pad cleaning, and etchback for HDI and flexible and rigid circuit board applications.

• Low CF4 gas consumption for desmear applications, contributes to the lowest cost of ownership in its class.

• Unique vacuum and gas flow technology, advanced electrode designs, and superior temperature management.

• Provides front and rear system access to all interior components for convenient service. The pump is positioned on rollers for easy
removal, and side access is not required.

MaxVIA

ITRACK-XL

PROVIA-LVD

FlexVIA

Plasma System

Plasma cleaning and treatment for semiconductor, microelectronic packaging and assembly, and medical device manufacturing.

• Plasma cleaning
• Surface activation
• Adhesion improvement



AP-600

PX-2400

Plasma System

Plasma Cleaner

Fully automated plasma system incorporating a high-capacity F3-S chamber. 

FlexTRAK-SHS

Plasma System 
Plasma Cleaning for wafers. 

Processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level - handling wafers up to 450mm and panels up to 480mm. 

MesoSPHERE

Plasma Treatment System
Legacy/Archived Tool

FlexTRAK-SH

Plasma System

Plasma Cleaner

Designed for processing larger substrates with high uniformity, quality and short cycle times. The platform features a 9.6 liter plasma chamber, which is twice the capacity of a standard FlexTRAK  plasma system.

FlexTRAK-S

FlexTRAK-BH 

PM-600

Plasma System

Plasma Cleaner

Features a large-capacity plasma chamber that can process up to 10 strips per plasma cycle.

FlexTRAK-CDS

PCB-400

The AP-300™ plasma system delivers exceptionally uniform plasma cleaning and treatment for semiconductor, microelectronic packaging and assembly, and medical device manufacturing.

AP-300

Plasma System
Plasma Cleaner

Plasma treatment with its large chamber for batch-type plasma processing.

AP-1500

PM-100

CS-1791

MaxVIA-PLUS

ProVIA

PCB-1600

PCB-800

AP Series

Plasma System 

Plasma Cleaner

Provides gold plasma processing.

The pump, chamber, control electronics and 13.56MHz power supply are housed in one body

AP-1000

PX-1000

PX-500

Plasma System

Inline processing of microelectronic devices held in boats, trays or other carriers. The advanced three-axis symmetrical plasma chamber treats all positions of a product uniformly, while maintaining tight control over process parameters for repeatable results.



FlexTRAK-2MB

RIE Plasma System 
Legacy/Archived tool. 
Reactive Ion Etching system 

CS-1701

PX-250

Plasma System

Plasma treatment quality and automation in one very configurable platform, resulting in high-throughput plasma processing and plasma cleaning for semiconductor and electronics packaging. The plasma chamber is capable of processes such as oxide removal, organic contamination clean and surface activation, depending upon chamber kit and electrode configuration.



FlexTRAK

FASTRAK

PX-1000E8

Plasma System

Plasma Cleaner

Features a plasma chamber that can process up to 5 strips per plasma cycle. All areas of a substrate are treated uniformly, while maintaining tight control over process parameters for repeatable results.

FlexTRAK-CD

PCB-2800

FlexVIA-Plus delivers superior uniformity and efficiency for applications such as surface treatment, etch back, and desmear. Uniform plasma treatment of both sides of the flex material surface area is possible, enabling rates of 140 – 200 units per hour (UPH). 

FlexVIA-Plus

The March Jupiter III is a parallel plate reactive ion etcher, which offers fast, uniform, and selective etching. The Jupiter III is typically used for wafer descumming and ashing. The maximum sample size is 6 inches. The system is equipped with a maximum 300W RF power supply. The available process gases are oxygen, argon, and forming gas which are adjustable using a rotameter.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

NORDSON / MARCH

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