LEDA P6801

ThermalAir TA-5000

The ThermalAir TA-5000 Series of temperature forcing systems bring precise thermal testing capabilities directly to your test application, exactly localizing to where thermal conditioning temperature cycling is required. ThermalAir TA-5000 temperature systems provide flexible thermal test solutions for an array of products and technologies.



TA-5000

M76FP

LEDA-3GP

SKYWALKER S6

ThermalAir TA-5000A - Outputs a controlled clean dry thermal air stream directly on your test part

TA-5000A

PS 380

HG 7900

M76A

MPI+WEIMING

LEDA-6SFA

PONE

The ThermalAir TA-3000 high capacity thermal air stream system is used for temperature testing, fast thermal cycling, and device temperature characterization of components, hybrids, modules, PCBs, and other electronic and non-electronic assemblies at precise temperature from -65°C to +225°C. Compact! Plus Performance!

TA-3000A

TS200-SE

TS3500

High-performance solution for on-wafer applications, offering RF measurements up to 67 GHz and broadband integration up to 220 GHz. Ideal for RF, DC, and high-power testing (up to 10 kV/400 A), it ensures 24/7 production reliability with safety interlocks. Ergonomically designed for seamless wafer handling, supporting up to 200 mm wafers and advanced optics for precise alignment. Compatible with thermal chucks (20–300 °C) and thin wafer handling down to 50 µm. Experience unparalleled accuracy and efficiency in semiconductor testing.

TS2500

TS3000

150 mm Manual Probe System for accurate and reliable DC/CV and RF measurements.



TS150

TS200

VEGA TP60-W1

The ThermalAir TA-1000 high capacity thermal air stream system is used for temperature testing, fast thermal cycling, and device  temperature characterization of components, hybrids, modules, PCBs, and other electronic and non-electronic assemblies at precise temperature from -25°C to +200°C.

TA-1000A

TS3000A

The ThermalAir TA-1000B high capacity thermal air stream system is used for temperature testing, fast thermal cycling, and device  temperature characterization of components, hybrids, modules, PCBs, and other electronic and non-electronic assemblies at precise temperature from -25°C to +200°C.

MPI

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