The System 1 family of ashers and etchers remains a reliable and cost-effective solution for semiconductor IC fabs, optoelectronics, Thin Film Head/Data Storage, and MicroElectro-Mechanical Systems (MEMS) in Silicon, Gallium Arsenide, and Indium Phosphide processing. Handle wafer sizes ranging from 50mm to 150mm round and 4.5" square with ease.

MATRIX

SYSTEM ONE

The Matrix System One Model 105 Asher is a single chamber, automatic microprocessor-controlled photoresist stripper that is set up for 4″ – 6″ wafers. It is configured for up to 6″ wafers and has independent control of pressure, RF power, temperature, gas flow, & substrate position. The Matrix 105 Asher has a 600W RF water-cooled generator and a multi-step program (three steps + over etch) process program. It also has a “Butterfly” Valve for more precise pressure control and a phase magnitude detector to provide real-time RF impedance matching control. The Matrix 105 Asher has two Mass Flow Controllers and a Vacuum Hose Assembly. The range for Strip is 150C to 250C +/-5C and the range for Descum is 70C to 150C +/-5C. It also has a Wafer Lift Pin Assembly (up and down).

104 E

SYSTEM 10 1177 PM

BobCat 208S

CL-508

R-76

209S

SYSTEM TEN

Low temperature, controlled resist/polyimide strip, descum/clean, surface prep, metal de-oxidation, TFH clean.

The Matrix 303 is a legacy single-wafer downstream isotropic plasma etching and ashing system originally manufactured by Matrix Integrated Systems.

MATRIX

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104 E

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