With their modular design, DEK stencil printers can be adapted to meet your specific requirements, but the basic DEK features will always be there in the form of flexible yet highly efficient printing processes, first-class software, and competent support.

sophisticated system providing total solution on sorting, six-side inspection and flexibility for an individual unit testing and laser marking. Applications include wafer level packages / dice inspection comprising micro crack inspection at six sides and sorting according to wafer mapping generated from the upstream processes.

ASMPT / DEK

SUNBIRD

DEK provides the industry’s most powerful and flexible printing platforms. The following retrofittable DEK options help you further improve productivity and print quality on your DEK NeoHorizon printer:​

-Full flexible DEK All Purpose Clamping (APC) system​
-High flexibility and maximum cleaning performance with DEK Typhoon Cleaner
-DEK Grid-Lok: the universal board support system​
-DEK Paste Management: the best combination of automated paste dispensing with paste roll height control​
-Closed loop to SPI systems with ProDEK ​
-DEK Multiple Alignment of Singulated Substrates (MASS) offers a solution for individual optical alignment at a very high speed to boost your throughput​

NEOHORIZON

The DEK TQ L delivers maximum flexibility for circuit boards with dimensions of up to 600 by 510 millimeters. Based on the DEK TQ platform, this printer is also super-fast (with a core cycle time of only 6.5 seconds) and exceptionally precise (±17.0 microns @ 2 Cmk), all while taking up only 1.95 square meters of floor space.

TQ-L

NEOHORIZON 01iX

The DEK TQ is superfast (core cycle time: only 5 seconds), highly precise (±17.0 microns @ 2 Cmk), and a real space-saver. With two model versions, the platform now also features outstanding flexibility: the DEK TQ for boards measuring up to 400 by 400 millimeters, and the DEK TQ L for boards measuring up to 600 by 510 millimeters.

NEOHORIZON 03iX

GALAXY

Alignment accuracy: > 2.0 Cmk @ ±12.5 μm, (6 sigma)*
Machine capability: > 2.0 Cmk @ ±25 μm, (6 sigma)**
Shortest core cycle time (CCT): 11 seconds (8 seconds with option)
Operating system: Windows 7 Standard embedded
Squeegee pressure: Software-controlled, motorized with closed-loop feedback
Stencil positioning: Depth stop or semi-automatic stencil loading
Adjustable-width stencil mount: Variable stencil width adjustment for frame sizes ranging from 381 mm to 736 mm and thicknesses ranging from 25 mm to 38 mm
Understencil cleaning: DEK Interchangeable Under Stencil Cleaner (DEK IUSC) with programmable wet, dry and vacuum cleaning
Substrate size: 50 mm (X) x 40.5 mm (Y) to 510 mm (X) x 508.5 mm (Y)
Substrate thickness: 0.2 mm to 6 mm
Substrate weight: Up to 6 kg
Program creation: Less than 10 minutes
Substrate clamping: Over-the-top clamping, Edge clamping (optional), Vacuum (optional)
Temperature and humidity sensors: Statistical recording of temperature and humidity readings
Paste verification: Hawkeye 750 (optional)

ASMPT / DEK

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