FERROTEC / TEMESCAL

BJD 1800

FC 1800

VES 2550

FCE 2700

The Temscal FC-2800 and BCD-2800 are clean room-compatible coaters that offer high-throughput efficiency and lift-off capability at a source-to-substrate distance of either 34″ (866mm) or 42″ (1076mm). Both systems can be configured for either freestanding or through-the-wall clean room installation, and both support numerous combinations of deposition sources plus a variety of substrate fixtures and feeding, heating, and cleaning options.

FC-2800

FC 2000

**PARTS**

2E0163D

205-5443

FC-3200

CV-8-210

FCE 2500

FC-4400

The Temescal UEFC-4900 with Auratus is the compact version of the UEFC-5700. It represents the ultimate mid-sized coater for lift-off processes. The source-to-substrate distance and chamber angles in the UEFC-4900 have been optimized for 150mm wafers and the system supports 25 x 150mm wafers.

The load locked product chamber is pumped by a CTI model CT-500 cryogenic pump. Powerful cryopumps make it possible to pump this large chamber in 15 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.

UEFC-4900

EB SW SPCL

FCE 4800

FC-5700

The Temscal FC-3800 enables rapid processing of 150mm diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 150mm diameter wafers for lift off or thirty-six 150mm wafers for step coverage. The 38″ x 38″ x 28″ product chamber is pumped by a high throughput 16″ cryopump. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10″ cryopump.

FC-3800

FC-2700A

FC-2700

BJB 1800

The Temescal UEFC-5700 with Auratus represents our ultimate high-throughput platform for lift-off oriented evaporation. This system is designed to support the metallization of forty-two 150mm wafers per load via high capacity e-beam evaporation.

The load locked product chamber can be pumped by as many as two dedicated, high throughput 16-inch cryogenic pumps. Dual-cryopumps make it possible to pump this large chamber in 10 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.

UEFC-5700

CV-8-110

BJD 2000

FERROTEC / TEMESCAL

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