3D-Micromac AG is the industry leader in laser micromachining. 3D-Micromac AG develop processes, machines and turnkey solutions at the highest technical and technological level. 

Combining a state-of-the-art laser optic module with 3D-Micromac’s highly modular semiconductor wafer dicing platform, the microPRO™ XS provides laser annealing with high repeatability and high throughput. The system features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer—making it ideally suited for OCF in SiC power devices.

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microPRO XS

The laser system microMARK™ RXe 200, 3D-Micromac has revolutionized the efficiency of blocked lens engraving by using excimer lasers. Focus is put on a unique optical set-up and engraving quality. Customers benefit from low investment and small operating costs.

microMARK RXe 200

The microVEGA™xMR is the first industrial annealing system for selective integrated magnetic sensor formation. Incorporating a highly flexible tool configuration with on-the-fly spot and variable laser energy, the system can accommodate both Giant Magnetoresistance (GMR) and Tunnel Magnetoresistance (TMR) sensors, as well as easily adjust magnetic orientation, sensor position and sensor dimension—making it an ideal solution for magnetic sensor production.

microVEGA xMR

3D-Micromac‘s microCELL™ TLS is a highly productive laser system for the separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells for improved module reliability and less power degradation over the whole module lifetime. The ablation-free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full-scale manufacturing of crystalline half cells.

microCELL TLS

The advanced microCELL MCS laser cutting system has been developed to meet the photovoltaic (PV) market’s demands for boosting module power output and service life by minimizing power losses and providing for an exceptionally high mechanical strength of cut cells. It provides a free choice of cell-cutting layouts that range from half to shingled without compromising throughput or yield. Based on the proven TLS-Technology, which enables unmatched edge quality in solar cell cutting, the future-proof microCELL MCS fits into an intelligent, scalable production system with minimized efforts on upgrading by adding functionalities.

microCELL MCS

3D-Micromac offers the compact and maintenance-free DPSS laser system microMARK™ MCL to meet customer’s demand for high-quality marking with significantly decreased cost of ownership. The system is utilized for visible, invisible as well as for technical engravings of all kinds of spectacle lenses, including CR39, polycarbonate, high-index materials and even mineral glass. Furthermore, it is possible to mark hard and soft contact lenses. The use of a UV DPSS laser source achieves a high-quality marking result comparable to excimer laser engravings.

microMARK MCL 

3D-Micromac‘s microCELL OTF is a highly productive laser system for processing of mono- and polycrystalline silicon solar cells. The microCELL OTF meets cell manufacturers‘ demands for increasing the efficiency of PERC solar cells, by precise surface structuring, low operating costs, and highest availability. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects or microcracks.

microCELL OTF

The microPREP™ PRO enables laser-based sample preparation for a variety of specimen preparation applications. It complements existing approaches to sample preparation such as ion beam processing. A choice of laser sources is available for installation to enhance the individual preparation process. microPREP™ PRO is suited to ablate metals, semiconductors, ceramics, polymers, and compound materials. It creates new vistas for material and process development as well as failure analysis.

MicroPREP PRO

The microMARK™ MCF excimer laser system generates the engravings by cold laser ablation of 193 nm UV radiation. This results in a superior engraving quality considering all cosmetic aspects – without any heat affection and micro cracks. The industry-approved microMARK™ MCF system guarantees maximum throughput and availability.

microMARK MCF

Wafer Dicing System. TLS-Dicing System for Separation of Silicon and Silicon Carbide Wafers. The microDICE laser micromachining system leverages TLS-Dicing – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS-Dicing enables a clean process, micro-crack-free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300-mm wafer capable platform enables a true high-volume production process, especially for SiC-based devices. In addition, microDICE reduces the dicing cost per wafer by up to an order of magnitude or more compared to other wafer dicing approaches. Due to the contactless laser machining method, there is no tool wear and no expensive consumables are required. This results in up to 15X lower cost of ownership over the entire life-time of the dicing system.



microDICE

3D-Micromac‘s microSHAPE laser system is designed for the processing of large and flat substrates with high accuracy. The highly versatile system allows the combination of different laser processes in a single machine. In addition, it is capable of processing with multiple working heads – this parallel processing makes higher throughputs achievable. microSHAPE is an industry-proven solution for all kinds of ablative and non-ablative processes. These include cutting, selective removal of thin films, and structuring processes like engraving and marking. The microSHAPE system is suitable for machining a variety of materials, e.g. glass, metals, polymer, ceramics, display stacks, and coated substrates.

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