描述
ALD (Atomic Layer Deposition)配置
無配置OEM 代工型號說明
NT333™ has large wafer capacity as compared to single or dual wafer processing techniques. With the added capability of pre or post treatment steps included in each ALD cycle, NT333™ is capable of forming films of the highest quality while operating at low temperatures and providing tunable film stresses for a variety of applications. Additionally, NT333™ has unique plasma shield which mitigates plasma damage resulting in high quality films while maintain high stage rotation speeds.文檔
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TEL / TOKYO ELECTRON
NT333
已驗證
類別
ALD
上次驗證: 20 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
106449
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
NT333
類別
ALD
上次驗證: 20 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
106449
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
ALD (Atomic Layer Deposition)配置
無配置OEM 代工型號說明
NT333™ has large wafer capacity as compared to single or dual wafer processing techniques. With the added capability of pre or post treatment steps included in each ALD cycle, NT333™ is capable of forming films of the highest quality while operating at low temperatures and providing tunable film stresses for a variety of applications. Additionally, NT333™ has unique plasma shield which mitigates plasma damage resulting in high quality films while maintain high stage rotation speeds.文檔
無文檔